TO series thermal conductive silicone cap is a kind of sleeve products which is made through special processing,adding ceramic thermal conductive powder in the form of high polymer .Because of its excellent thermal conductivity, insulation, shock resistance and easy installation, the product is widely used in fever transistor, diode and audion. It can installed directly on the heating tube when using the product. The TO series are suggested to be used for low-stress application environment.
Test item |
Unit |
TO-220A |
TO-220B |
TO-220C |
TO-3PA |
TO-3PB |
Color |
|
Grey/blue |
Grey/blue
|
Grey/blue
|
Grey/blue
|
Grey/blue
|
Specific Gravity |
g/cm³ |
1.7 |
1.7 |
1.7 |
1.7 |
1.7 |
Hardness |
Shore A |
85±5 |
85±5 |
85±5 |
85±5 |
85±5 |
Continuous use temp |
°C |
-40~200 |
-40~200 |
-40~200 |
-40~200 |
-40~200 |
Voltage Endurance |
Kv/mm |
3.0 |
3.0 |
3.0 |
3.0 |
3.0 |
Flame rating |
|
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
Conductivity |
w/m-k |
1.0 |
1.0 |
1.0 |
1.0 |
1.3 |
Thermal resistance |
kcal/m.h°C |
2.3*10³ |
2.3*10³ |
2.3*10³ |
2.3*10³ |
2.3*10³ |
°C/w |
0.28 |
0.28 |
0.28 |
0.28 |
0.28 |
- Specifications and Model number
|
TO-220A |
TO-220B |
TO-220C |
TO-3PA |
TO-3PB |
TO-3PC |
DIM A |
21.5±0.5 |
16.0±0.5 |
21.8±0.5 |
28.5±0.5 |
28.8±0.5 |
22.0±0.5 |
DIM B |
11.5±0.5 |
11.5±0.5 |
12.1±0.5 |
17.5±0.5 |
18.2±0.5 |
17.5±0.5 |
DIM C |
5.9±0.3 |
5.9±0.3 |
6.5±0.3 |
5.9±0.3 |
6.6±0.3 |
5.9±0.3 |
DIM D |
0.6±0.1 |
0.6±0.1 |
0.8±0.1 |
0.6±0.1 |
0.8±0.1 |
0.6±0.1 |
- Features and benefits Applications
- Thermal conductive and insulation; 1.Transistor and diode;
-
Fireproofing,eco-friendly,anti-compressing. 2.IGBT mosfet
Thermal interfce material working theorem and introduction
Thermal Interface Materials are widely used for the heat conduction of IC and electronic products, which fill between the small gap and rough holes to reduce the thermal resistance and improve the thermal conductive performance.
To keep the work temperature of the component junction within the safety temperature, the heat from the semiconductor must be transferred to the surroundings. The procedure include the heat transferred from thesurface of device to the heatsink and the surroundings. The heat sink should be attached with the device carefully to make the thermal resistance as small as possible.If attach the heat sink with surface of the semiconductor, it requires that the two part should be contected tightly.
The surfaces are always rough, which only can be seen under the microscope. When the two surfaces contected, only the high points are touched, the low points form the air gap. And there are over 90% of the contact zone are air gap, which means it will be the thermal resistance.The thermal interface materials can fill the air gap and the rough surface, its thermal conductivity is much higher that the air, through the TIMs, the thermal resistance of the junction will be less, and the temperature will be lower.
About us
Sky-ever is a one -stop wholesale for your electronic components and parts.Here you will find a large and complete collection of electronic components:
thermal interface material like thermal conductive silicone rubber pad/sheet/gasket , thermal conductive tape , thermal conductive ceramics , thermal conductive grease/paste , thermal conductive silicone rubber cap/tube,etc ;
Heat sink for computer/laptop ;
Connectors like pin header , female header , male header , RJ45 plug , IDC , Ejector , D-sub , etc .
If there is no your need , please do not worry and do not give up, just click the keyboard or phone to send your requirements to us ,we will get back to you within 24 hours !
Our goal is to provide best quality , best price and best service to achieve a win-win cooperation.
Looking forward to your inquiry !
Our strong shipping & payment term
1.by courier,like DHL,UPS,FEDEX,etc.It is door to door,usually,3-4 days to arrive.
2.by air to the air port,usually,5-7 days to arrive.
3.by sea to sea port,usually,15-30 days to arrive
4.can be shipped by our specific agent.
FAQ
Q:What’s the thermal conductivity test method given on the data sheet?
A: All the data in the sheet are tested out by the third party. ASTM D5470 is utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for your application?
A: It depends on the watts of power source, ability of heat dissipation. For any customers, please contact us for the technical support.
Q: Are thermal pads offered with tacky?
A: Yes, all the thermal pads have its inherent tacky. All the models are natural tacky for two sides, except for the LCP series ,only one side has natural tacky. LCB series thermal pads can be cover 3M glue with strong adhesive.
Q: Are thermal pads reworkable?
A: It’s depend on the application and the pad being used. Thermal pads have been reused before, however,it’s up to the judgment of product designer, to see whether the pads could withstand reuse.
Q:Will the heat make the thermal pads softer?
A: ShoreC 20~80 ,there is no significant change in the hardness of thermal pads, as gap filler.
Q: What’s the tolerance for the thickness?
A :Normally ±0.1mm.
Q: Are the thermal pads electrical insulating?
A: Yes, all thermal pads are electrically isolated.
Q: What’s the shelf life for thermal pads?
A: Shelf life for thermal pad is one year after the date of manufacture. For the pads with adhesive, the shelf life is 6months after the date of manufacture. After these dates, all the characters should be retested.
Q: Can the thermal pads be with fiberglass?
A: YES, we could have thermal pads with fiberglass center to improve customer specific requirements for the tensile strength.LCP series has fiberglass on its surface, all other models will be made at your requirement.